STM32F103RCT6

Product Summary

The STM32F103xC, STM32F103xD and STM32F103xE performance line familyincorporates the high-performance ARM? Cortex?-M3 32-bit RISC core operating at a72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes andSRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripheralsconnected to two APB buses. All devices offer three 12-bit ADCs, four general-purpose 16-bit timers plus two PWM timers, as well as standard and advanced communicationinterfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and aCAN.

Parametrics

Absolute maximum ratings:
(1)VDD–VSS,External main supply voltage (including VDDAand VDD):-0.3 to 4.0V;
(2)VIN,Input voltage on five volt tolerant pin:VSS 0.30 to +5.5V;Input voltage on any other pin:VSS 0.30 to VDD+0.3V;
(3)VDDx,Variations between different VDD power pins:50mV;
(4)|VSSX ,VSS| Variations between all the different ground pins:50mV;
(5)IVDD,Total current into VDD/VDDA power lines (source):150mA;
(6)IVSS,Total current out of VSS ground lines (sink):150mA;
(7)IIO,Output current sunk by any I/O and control pin;Output current source by any I/Os and control pin:25mA;
(8)IINJ(PIN),Injected current on NRST pin;Injected current on HSE OSC_IN and LSE OSC_IN pins;Injected current on any other pin:±5mA;
(9)IINJ(PIN),Total injected current (sum of all I/O and control pins):±25mA;
(10)TSTG,Storage temperature range:-65℃ to +150℃;
(11)TJ,Maximum junction temperature:150℃

Features

(1)Core: ARM 32-bit Cortex-M3 CPU;72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1);performance at 0 wait state memoryaccess; Single-cycle multiplication and hardwaredivision; (2)Memories:256 to 512 Kbytes of Flash memory;up to 64 Kbytes of SRAM;Flexible static memory controller with 4Chip Select. Supports Compact Flash,SRAM, PSRAM, NOR and NAND memories;LCD parallel interface, 8080/6800 modes; (3)Clock, reset and supply management:2.0 to 3.6 V application supply and I/Os;POR, PDR, and programmable voltagedetector (PVD);4-to-16 MHz crystal oscillator;Internal 8 MHz factory-trimmed RC;Internal 40 kHz RC with calibration;32 kHz oscillator for RTC with calibration; (4)Low power:Sleep, Stop and Standby modes;VBAT supply for RTC and backup registers; (5)3 × 12-bit, 1 μs A/D converters (up to 21channels):Conversion range: 0 to 3.6 V;Triple-sample and hold capability;Temperature sensor; (6) × 12-bit D/A converters; (7)DMA: 12-channel DMA controller;Supported peripherals: timers, ADCs, DAC,SDIO, I2Ss, SPIs, I2Cs and USARTs; (8)Debug mode:Serial wire debug (SWD) & JTAG interfaces;Cortex-M3 Embedded Trace Macrocell; (9)Up to 112 fast I/O ports: 51/80/112 I/Os, all mappable on 16external interrupt vectors and almost all 5 V-tolerant; (10)Up to 11 timers:Up to four 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input;2 × 16-bit motor control PWM timers with dead-time generation and emergency stop;2 × watchdog timers (Independent and Window);SysTick timer: a 24-bit downcounter;2 × 16-bit basic timers to drive the DAC; (11)Up to 13 communication interfaces:Up to 2 × I2C interfaces (SMBus/PMBus);Up to 5 USARTs (ISO 7816 interface, LIN,IrDA capability, modem control);Up to 3 SPIs (18 Mbit/s), 2 with I2Sinterface multiplexed;CAN interface (2.0B Active);USB 2.0 full speed interface;SDIO interface; (12)CRC calculation unit, 96-bit unique ID; (13)ECOPACK packages

Diagrams

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