AT24C08AN-PU2.7

Two-wire Serial EEPROM

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Price:: US $8.00~12.00 / piece [Get Latest Price]

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	US $8.00~12.00

PartNumber:: AT24C08AN-PU2.7

Brand:: ATMEL Corporation - ATMEL | Pack: SOP | D/C: 10+

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Products Upload time: 2012-07-17

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Part Number:AT24C08AN-PU2.7
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Product Summary

The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serialelectrically erasable and programmable read-only memory (EEPROM) organized as128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in manyindustrial and commercial applications where low-power and low-voltage operationare essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-leadPDIP,8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23(AT24C01A/AT24C02/AT24C04), 8-lead TSSOP, and 8-ball dBGA2 packages and isaccessed via a Two-wire serial interface. In addition, the entire family is available in2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.

Parametrics

Absolute Maximum Ratings:(1)Operating Temperature:-55℃ to +125℃; (2)Storage Temperatur:-65℃ to +150℃; (3)Voltage on Any Pinwith Respect to Ground:-1.0V to +7.0V; (4)Maximum Operating Voltage:6.25V; (5)DC Output Current:5.0 mA

Features

(1)Low-voltage and Standard-voltage Operation:2.7 (VCC = 2.7V to 5.5V); 1.8 (VCC = 1.8V to 5.5V); (2)Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),1024 x 8 (8K) or 2048 x 8 (16K); (3)Two-wire Serial Interface; (4)Schmitt Trigger, Filtered Inputs for Noise Suppression; (5)Bidirectional Data Transfer Protocol; (6)100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility; (7)Write Protect Pin for Hardware Data Protection; (8)8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes; (9)Partial Page Writes Allowed; (10)Self-timed Write Cycle (5 ms max); (11)High-reliability:Endurance: 1 Million Write Cycles;Data Retention: 100 Years; (12)Automotive Devices Available; (13)8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-leadSOT23, 8-lead TSSOP and 8-ball dBGA2 Packages; (14)Die Sales: Wafer Form, Waffle Pack and Bumped Wafers